Thermal management is the process of dispensing either a single-component or plural-component thermally conductive material onto printed circuit boards within electronic control modules. Thermally conductive material draws heat away from a printed circuit board and extends the life of the control module.

The dispensed media, which is usually high-viscosity and silicone based, contains a thermally conductive abrasive filler. Volumes dispensed generally range from 1 to 50 cc’s.